Method for manufacturing liquid crystal device

ABSTRACT

A method for manufacturing a liquid crystal device that includes forming an inorganic alignment layer by emitting an alignment film material that is made of an inorganic material in an oblique direction onto a substrate, and forming an organic alignment layer that is a monomolecular film made of an organic material chemically bonded with the inorganic alignment layer on a surface of the inorganic alignment layer by treating the surface of the inorganic alignment layer with a silane coupling agent that has an alkyl group, wherein a pretilt angle of a liquid crystal molecule is set to a desired angle by selecting the silane coupling agent by the number of carbon atoms.

CROSS-REFERENCE TO RELATED APPLICATION

This is a divisional application of U.S. application Ser. No. 12/434,111filed May 1, 2009 which claims priority to Japanese Patent ApplicationNo. 2008-128031 filed on May 15, 2008 both of which are incorporatedherein by reference in their entireties.

BACKGROUND

1. Technical Field

The present invention relates to a method for manufacturing a liquidcrystal device.

2. Related Art

JP-A-2007-286401 is an example of related art. As described in theexample, a method for manufacturing a liquid crystal device in which aninorganic alignment film is fabricated by using a manufacturingapparatus that includes a film forming chamber and sputtering equipmenthas been known. In the film forming chamber, the alignment film isformed of an alignment film forming material on a substrate bysputtering.

The example adopted a so-called facing target sputtering (FTS) method inwhich an inorganic alignment film is formed by using the sputteringequipment that has a pair of targets and the targets oppose each otherwith a plasma forming region therebetween.

The manufacturing apparatus disclosed in the example also has anelectron capture means (a magnetic field generator) that traps orreflects electrons contained in the plasma forming region. Moreover anopening through which sputtered particles are emitted from the plasmaforming region is disposed in the apparatus at a position where thesputtered particles obliquely fall onto a substrate.

In this way, it is avoided that an inorganic alignment film having anunintended configuration is formed because of plasma, and making itpossible to obtain a fine inorganic alignment film.

However, the above-described method for manufacturing the liquid crystaldevice has an disadvantage that a pretilt angle of liquid crystalmolecules becomes too small when an incident angle of the sputteredparticle, which is the angle between the sputtered particle and a normalline of the substrate, is made small. This deteriorates a displayquality of the liquid crystal device.

When the incident angle of the sputtered particle is made large, thepretilt angle of the liquid crystal molecules can be made large.However, in this case, a film formation rate is decreased. Moreover, adistance between the substrate and the opening of the sputteringequipment becomes large, which makes the whole size of the equipment toobig.

Furthermore, when the inorganic alignment film fabricated by the FTSmethod is made of silicon oxide, many polarized hydroxyl groups exist onthe surface of the film and these hydroxyl groups weaken amoisture-proof property of the inorganic alignment film. As a result,resistance of the liquid crystal device to moisture and light isdecreased.

SUMMARY

An advantage of the present invention is to provide a method formanufacturing a liquid crystal device with which a desired pretilt angleof liquid crystal molecules and a fine film formation rate areobtainable, downsizing of the manufacturing apparatus is possible andwith which an alignment film with a fine moisture-proof property and ahigh light resistance can be formed.

A method for manufacturing a liquid crystal device that has a liquidcrystal layer interposed between a pair of substrates which oppose eachother and an alignment film which is formed on an inner face side of atleast one of the substrates according to the invention includes formingan inorganic alignment layer that has a plurality of columnar structuresin which crystals grow in an oblique direction with respect to a normalline of the substrate by using sputtering equipment in which a pair oftargets oppose each other with a plasma forming region interposedtherebetween, by emitting an alignment film material that is made of aninorganic material in an oblique direction onto the substrate from thetargets, and forming an organic alignment layer that is a monomolecularfilm made of an organic material chemically bonded with the inorganicalignment layer on a surface of the inorganic alignment layer bytreating the surface of the inorganic alignment layer with a silanecoupling agent that has an alkyl group, and a pretilt angle of a liquidcrystal molecule is set to a desired angle by selecting the silanecoupling agent by the number of carbon atoms.

According to the method, plasma is generated between the pair of thetargets in the sputtering equipment at the time of formation of theinorganic alignment layer, and it is possible to prevent the inorganicalignment layer on the substrate from being affected by the plasma.

Moreover, according to the method, at the time when the organicalignment layer is formed by treating the surface of the inorganicalignment layer, it is possible to adjust the pretilt angle of thealignment film to a desired angle with the silane coupling agent.Therefore it is not necessary to increase an emission angle of thealignment film material in order to obtain a large pretilt angle. As aresult, it is possible to prevent deterioration of a film forming rateand growth in size of the apparatus.

In addition, even when the inorganic alignment layer is made of forexample silicon oxide, the silane coupling agent reacts with polarizedhydroxyl groups existing in the surface of the inorganic alignment layerso that the hydroxyl groups will not deteriorate or give an adverseeffect to the liquid crystal.

In this way, it is possible to provide a method for manufacturing aliquid crystal device with which a desired pretilt angle of liquidcrystal molecules and a fine film formation rate are obtainable,downsizing of the manufacturing apparatus is possible and with which analignment film with a fine moisture-proof property and a high lightresistance can be formed.

It is preferable that the sputtering equipment emit the alignment filmmaterial at an emission angle of less than 60° with respect to thenormal line direction of the substrate.

In this way, the decrease in the film formation rate can be prevented.At the same time, the distance between the substrate and the sputteringequipment can be shorten thereby it is possible to downsize themanufacturing apparatus.

It is also preferable that the emission angle with respect to the normalline direction be 45° or less.

In this way, a fine film formation rate can be obtainable. At the sametime, the distance between the substrate and the sputtering equipmentcan be further shorten thereby it is possible to downsize themanufacturing apparatus.

It is preferable that the silane coupling agent with the number of thecarbon atoms of 6 to 18 both inclusive be used.

In this way, it is possible to set the pretilt angle of the alignmentfilm to in the range of about 3° to 8° both inclusive.

It is also preferable that the silane coupling agent with the number ofthe carbon atoms of 8 to 10 both inclusive be used.

In this way, it is possible to manufacture the alignment film that hasboth the moisture resistance and the light resistance.

It is also preferable that the silane coupling agent with the number ofthe carbon atoms of 10 or more but less than 18 be used.

In this way, it is possible to set the pretilt angle of the alignmentfilm to in the optimum range of about 4° to 6° both inclusive.Consequently it is possible to improve a display quality of the liquidcrystal device.

Moreover, it is preferable that the pretilt angle is set to 3° or morefrom the normal line direction.

In this way, it is possible to prevent the display quality of the liquidcrystal device from being deteriorated.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention will be described with reference to the accompanyingdrawings, wherein like numbers reference like elements.

FIG. 1 is a sectional view of a liquid crystal device according to anembodiment of the invention.

FIGS. 2A and 2B are enlarged sectional views of an alignment filmaccording to an embodiment.

FIG. 3 is an enlarged fragmentary view of parts P, Q in FIG. 2.

FIG. 4 is a chart showing a relation between the number of carbon atomsof an organic alignment layer according to the embodiment and a pretiltangle θ.

FIG. 5 is a chart showing a relation between the number of the carbonatoms of the organic alignment layer according to the embodiment andresistances to light and moisture.

FIG. 6 is a chart showing a relation between a duration time and theamount of change in voltage at the time a voltage is applied to theliquid crystal device according to the embodiment.

FIGS. 7A and 7B illustrate an apparatus for manufacturing the liquidcrystal device according to an embodiment, FIG. 7A is a schematicconfiguration diagram of the manufacturing apparatus and FIG. 7B is aside view of sputtering equipment showing its configuration.

FIGS. 8A and 8B illustrate the sputtering equipment according to theembodiment, FIG. 8A is a plan view of the sputtering equipment and FIG.8B is a fragmentary view taken in a direction of the arrows G, G′ inFIG. 8A.

DESCRIPTION OF EXEMPLARY EMBODIMENTS

Embodiments of the invention will be described. In the accompanyingdrawings, a scale size may be different among members or layers in orderto make each member or layer recognizable for illustration purpose.

FIG. 1 schematically illustrates a sectional structure of a liquidcrystal device according to an embodiment of the invention. Schematicfeatures of the liquid crystal device of the embodiment will bedescribed with reference to FIG. 1.

Liquid Crystal Device

Referring to FIG. 1, a liquid crystal device 100 according to theembodiment has a liquid crystal panel 50. The liquid crystal panel 50includes a circuit substrate 10 and a counter substrate 20 which isdisposed so as to oppose the circuit substrate 10 with a liquid crystallayer 58 interposed therebetween. The liquid crystal layer 58 is made ofa liquid crystal material including a liquid crystal molecule 52 whoseinitial alignment is vertical orientation and whose dielectricanisotropy property is negative.

The circuit substrate 10 includes a substrate body 10A that is made ofan optically transparent material such as glass. A pixel electrode 9 isprovided on an inner face side (the side closer to the liquid crystallayer 58) of the substrate body 10A. The pixel electrode has arectangular shape when viewed in plan and is made of a transparentconductive material such as indium tin oxide (ITO). The circuitsubstrate 10 further includes a thin film transistor (TFT) element, adata line to which an image signal is supplied, a scan line, a lightshielding film and the like (all of these components are not shown inthe drawing). The TFT element is a switching element for controllingcurrent supply to the pixel electrode 9. The pixel electrode 9 isprovided in the plural number and an alignment film 11 is disposed so asto cover the plurality of the pixel electrodes 9 on the inner face sideof the circuit substrate 10.

The counter substrate 20 includes a substrate body 20A that is made ofan optically transparent material such as glass. A common electrode 21that is made of a transparent conductive film such as ITO is provided onan inner face side of the substrate body 20A. The common electrode 21 isformed in a blanket-deposited manner on the substantially whole face ofthe substrate body 20A. The counter substrate 20 can further include acolor filter, a light shielding film and the like (not illustrated inthe drawing). An alignment film 22 is provided on the inner face side ofthe counter substrate 20 so as to cover the common electrode 21.

The alignment film 11 of the circuit substrate 10 and the alignment film22 of the counter substrate 20 have a function to provide a pretiltangle θ to the liquid crystal molecules 52. The liquid crystal molecules52 forming the liquid crystal layer 58 is vertically aligned with apredetermined pretilt angle θ which is determined by the alignment films11, 22 at an initial alignment state (when no voltage is applied).

FIG. 2A and FIG. 2B are enlarged sectional views of the alignment film11 of the circuit substrate 10 and the alignment film 22 of the countersubstrate 20 respectively. FIG. 3 is an enlarged fragmentary viewshowing parts (parts P, Q circled in dashed line) in FIG. 2A and FIG.2B.

Referring to FIG. 2A and FIG. 2B, the alignment films 11, 22 includeinorganic alignment layers 11 a, 22 a and organic alignment layers 11 b,22 b respectively.

The inorganic alignment layers 11 a, 22 a are made of for examplesilicon oxide such as SiO₂ and SiO. The inorganic alignment layers 11 a,22 a have a plurality of columnar structures in which crystals grow inan oblique direction with respect to normal lines L1, L2 of the circuitsubstrate 10 and the counter substrate 20 respectively. In this way, theinorganic alignment layers 11 a, 22 a respectively provide the pretiltangle θ of for example about 1.2° to the liquid crystal molecule 52.

The organic alignment layers 11 b, 22 b are made of a monomolecular filmthat is made from an organic material which is chemically bonded withthe inorganic alignment layers 11 a, 22 a. More specifically, referringto FIG. 3, the organic material is mainly made of an alkyl chain 28 thatis coupled with a Si atom of the inorganic alignment layers 11 a, 22 a.The number of the carbon atoms in the alkyl chain 28 used here is 6 to18 (both inclusive).

Referring to FIG. 1, a pair of polarization plates 61, 62 is provided onthe both sides of the liquid crystal panel 50. The polarization plates61, 62 are disposed such that their polarizing axes are placed at anglesof about 45°, 135° respectively from an orientation angle of the liquidcrystal, and the polarizing axes are crossed each other at asubstantially orthogonal angle. An unshown light source unit is providedon an outer side (a side adjacent to the polarization plate 61) of thepolarization plate 61.

In the liquid crystal device 100 having the above-described structure,the liquid crystal molecule 52 is vertically aligned and has apredetermined pretilt angle θ when no voltage is applied.

The liquid crystal molecules 52 in the liquid crystal layer 58 are laidsubstantially in parallel to the substrate face by applying a voltagebetween the pixel electrode 9 and the common electrode 21. At thispoint, the direction in which the liquid crystal molecules 52 are laidcan be determined by the pretilt angle θ.

FIG. 4 is a chart showing a relation between the number of carbon atomsand the pretilt angle θ, the horizontal axis is the number of the carbonatoms in the alkyl group of the organic alignment layer 11 b, 22 b, andthe vertical axis is the pretilt angle θ.

Referring to FIG. 4, “Ref” in the horizontal axis referrers to areference inorganic alignment film that consists of only the inorganicalignment layers 11 a, 22 a. More specifically, the inorganic alignmentlayers 11 a, 22 a of the liquid crystal device 100 has a function togive the pretilt angle θ of about 1° to 1.5° to the liquid crystalmolecule 52.

When the number of the carbon atoms in the alkyl group of the organicalignment layer 11 b, 22 b is 6 to 18 (both inclusive), the pretiltangle θ can be set in the range of about 3° to 8° as shown in FIG. 4.

When the number of the carbon atoms 10 or more but less than 18, morespecifically, 10 to 16 (both inclusive) or 10 to 17 (both inclusive),the pretilt angle θ can be set in the preferable range of about 4° to 6°which is indicated by the dashed line in the drawing. In this way, it ispossible to align the liquid crystal molecules in the desired directionsecurely thereby it is possible to improve a display quality of theliquid crystal device.

FIG. 5 is a chart showing a relation between the number of the carbonatoms in the alkyl group and resistances to light and moisture, thehorizontal axis is the number of the carbon atoms in the alkyl group ofthe organic alignment layer 11 b, 22 b, and the vertical axes are theresistances to light and moisture.

In the chart, a square mark (□) denotes the resistance to moisture, anda rhomboid mark (♦) denotes the resistance to light. “Ref (1)” in thehorizontal axis referrers to a reference inorganic alignment film thatconsists of only the inorganic alignment layers 11 a, 22 a. “Ref (2)”referrers to another reference inorganic alignment film that is made ofpolyimide and to which a rubbing treatment has been performed. The valueof the light resistance in the vertical axis is a coefficient where thelight resistance of the polyimide alignment film referred as “Ref (2)”is 1. The scale of the vertical axis showing the moisture resistance inFIG. 5 is a coefficient of time period of an acceleration test where 500hours equals to 3, the condition of the acceleration test is 60° C. oftemperature and 90% of humidity.

Referring to FIG. 5, when the number of carbon atoms in the alkyl groupof the organic alignment layers 11 b, 22 b is 6 to 18 (both inclusive),better resistances to moisture and light can be obtained compared to anormal polyimide alignment film and to an inorganic alignment filmalone.

Moreover, when the number of the carbon atoms is 8 to 10 (bothinclusive), it is possible to obtain the alignment films 11, 22 thathave a fine durability with high resistances to light and moisture,which is shown in the area circled by the dashed line in FIG. 5.

FIG. 6 is a chart showing a relation between a duration time and theamount of change in a voltage at the time when the voltage is appliedbetween the pixel electrode 9 and the common electrode 21 in the liquidcrystal device 100, the horizontal axis is the duration time and thevertical axis is the amount of change in the voltage.

Referring to the chart, a solid line C8 represents the alignment films11, 22 having the organic alignment layers 11 b, 22 b in which thenumber of the carbon atoms in the alkyl group is 8. A dashed line C10 inthe chart represents the alignment films 11, 22 having the organicalignment layers 11 b, 22 b in which the number of the carbon atoms inthe alkyl group is 10, and a dashed-dotted line C18 in the chartrepresents the alignment films 11, 22 having the organic alignmentlayers 11 b, 22 b in which the number of the carbon atoms is 18

Referring to FIG. 6, the amount of change in the voltage between thepixel electrode 9 and the common electrode 21 can be controlled withinthe range of +0.1 V to −0.2 V by setting the number of the carbon atomsof the organic alignment layers 11 b, 22 b to 8 to 10 (both inclusive).When the number of the carbon atoms is 8, the amount of the voltagechange can be kept in the range of about 0 V to +0.1 V. When the numberof the carbon atoms is 10, the change in the voltage can be limited inthe range of about −0.1 V to −0.2 V.

In other words, by selecting the number of the carbon atoms of theorganic alignment layers 11 b, 22 b, it is possible to balancepermittivity between the substrate 10 and the substrate 20 at the timewhen a voltage is applied between the common electrode 21 and the pixelelectrode 9. Therefore electric asymmetry between the substrates 10, 20will hardly occur and a LCcom variation due to longtime driving isrefrained. Consequently it is possible to improve the display quality.

Apparatus for Manufacturing the Liquid Crystal Device

An apparatus for manufacturing the liquid crystal device 100 accordingto the embodiment will be now described.

FIG. 7A is a schematic configuration diagram of an apparatus formanufacturing the liquid crystal device 100 of the embodiment. FIG. 7Bis a side view of sputtering equipment 3 which is viewed in an Xadirection showing its configuration.

Referring to FIG. 7A, a manufacturing apparatus 1 is a machine thatforms the inorganic alignment layers 11 a, 22 a on a substrate W bysputtering. The substrate W encompasses a substrate that is a componentof the liquid crystal device 100 such as the circuit substrate 10 andthe counter substrate 20. The manufacturing apparatus 1 includes a filmforming chamber 4 that is a vacuum chamber in which the substrate W isplaced, and the sputtering equipment 3 with which the inorganicalignment layers 11 a, 22 a made of an inorganic material are formed ona surface of the substrate W by a sputtering method. The sputteringequipment 3 has a gas supplier 31 through which an argon gas forelectric discharge is supplied to a plasma forming region. The filmforming chamber 4 has a gas supplier 32 through which an oxygen gas issupplied. The oxygen gas is used as a reactive gas that reacts with thealignment film material flying over the substrate W inside the filmforming chamber and the inorganic alignment layers 11 a, 22 a areformed.

An exhaust control unit 42 for controlling an internal pressure andobtaining a desired degree of vacuum is coupled to the film formingchamber 4 through a pipe 41. An equipment coupling part 43 which is apart coupling the film forming chamber and the sputtering equipment 3 isprovided such that it protrudes outside from a lower wall of the filmforming chamber 4 as shown in the drawing. The equipment coupling part43 extends in an oblique direction at a predetermined angle θ1 withrespect to a normal line direction (the Z axis direction in the drawing)of the film formation face of the substrate W which is placed inside thefilm forming chamber 4. Thereby the sputtering equipment 3 that isjointed at the tip of the equipment coupling part is disposed slantwiseat the predetermined angle θ1 with respect to the substrate W.

The gas supplier 32 is coupled to the equipment coupling part 43 at theside opposite to the exhaust control unit 42. The oxygen gas suppliedfrom the gas supplier 32 flows in the direction designated by the arrow22 f in the drawing, more specifically from +X side of the film formingchamber 4 toward the exhaust control unit 42 side which is −X directionin the drawing through over the substrate W.

In an actual manufacturing apparatus, provided is a load lock chamberwith which makes it possible to carry the substrate W in and out of thefilm forming chamber 4 while maintaining the chamber as a vacuum. Theload lock chamber is installed outside the film forming chamber 4 in theX axis direction. The load lock chamber is also coupled to an exhaustcontrol unit that separately controls a vacuum atmosphere inside theload lock chamber. The load lock chamber and the film forming chamber 4are coupled through a gate valve that air-tightly closes between thechambers. With such feature, it is possible to take the substrate W inand out from the chamber without exposing the film forming chamber 4 tothe air.

The sputtering equipment 3 is counter target type sputtering equipmentin which two targets 5 a, 5 b oppose each other. The target 5 a isattached to a first electrode 33 a which has a substantially plateshape, and the target 5 b is attached to a second electrode 33 b whichalso has a substantially plate shape. The targets 5 a, 5 b that aresupported by the first electrode 33 a and the second electrode 33 brespectively are made of a material containing at least one of theconstituents of the inorganic alignment layers 11 a, 22 a provided onthe substrate W, such material can be for example silicon. The targets 5a, 5 b have a long and narrow plate shape extending in the Y directionin the drawing (see FIGS. 8A and 8B), and they are disposed such thattheir opposing faces become parallel each other.

The first electrode 33 a is coupled to a power source 4 a which is adirect-current (DC) power source or high-frequency power source, and thesecond electrode 33 b is coupled to a power source 4 b which is a DCpower source or high-frequency power source. Electric power that issupplied from the power sources 4 a, 4 b generates plasma Pz in a space(the plasma forming region) between the target 5 a and the target 5 b.

A cooling unit 8 a that cools the target 5 a is provided at the sideopposite to the target 5 a of the first electrode 33 a. A refrigerantcirculator 18 a is coupled to the cooling unit 8 a through a pipe andthe like. A cooling unit 8 b that cools the target 5 b is provided atthe side opposite to the target 5 b of the second electrode 33 b. Arefrigerant circulator 18 b is coupled to the cooling unit 8 b through apipe and the like. Referring to FIG. 7B, the cooling unit 8 a has asubstantially same planar size with the target 5 a and is disposed so asto overlap with the target 5 a when viewed in plan with the firstelectrode 33 a interposed therebetween. Though not shown in the drawing,the cooling unit 8 b is also disposed in the same manner so as tooverlap with the target 5 b when viewed in plan. The cooling units 8 a,8 b respectively have a refrigerant flow passage in which refrigerantflows inside the units. The refrigerant supplied from the refrigerantcirculators 18 a, 18 b to the refrigerant flow passage is circulated,which cools the targets 5 a, 5 b.

Referring to FIG. 7B, a magnetic field generator 16 a which is arectangular frame shaped permanent magnet, electromagnet, these magnetcombined or the like is provided so as to surround the cooling unit 8 awhich has a rectangular shape when viewed in plan. A magnetic fieldgenerator 16 b that is disposed so as to surround the cooling unit 8 b,which is illustrated in FIG. 1A, also has the same feature.

The cooling units 8 a, 8 b can be made of a conductive material and canbe electrically coupled to the first electrode 33 a and the secondelectrode 33 b respectively. In this case, the power sources 4 a, 4 bcan be electrically coupled to the cooling units 8 a, 8 b respectively.Moreover, the refrigerant flow passage can be provided inside the firstelectrode 33 a and the second electrode 33 b so that the first electrode33 a and the second electrode 33 b can also serve as the cooling unit.

FIGS. 8A and 8B illustrate the configuration of the sputtering equipment3 shown in FIG. 7A. FIG. 8A is a plan view of the sputtering equipment 3when viewed from the side of the film forming chamber 4. FIG. 8B is afragmentary view taken in the direction of the arrows G, G′ in FIG. 8A.

Referring to FIGS. 7A, 7B, 8A and 8B, a box-shaped case serving as avacuum chamber of the sputtering equipment 3 is formed of the firstelectrode 33 a, the second electrode 33 b, a side wall 34 to which oneend (the edge on the -Za axis side) of the first electrode and thesecond electrode is coupled, and side walls 33 c, 33 d to which bothends of the first electrode 33 a and the second electrode 33 b arecoupled in the Y axis direction. Note that the first electrode 33 a, thesecond electrode 33 b, and the side walls 33 c, 33 d, 34 that form thebox-shaped case are insulated each other. The box-shaped case has anopening 3 a through which a sputtered particle 5 p is emitted at itsedge part which is disposed at the side opposite to the side wall 34 ofthe first electrode 33 a and the second electrode 33 b. The box-shapedcase is coupled to the equipment coupling part 43 that protrudes out inthe film forming chamber 4 through the opening 3 a. In this way, theinside of the box-shaped case communicates with the inside of the filmforming chamber 4.

Referring to FIG. 7A, the gas supplier 31 is coupled to the side wall 34that is disposed at the side opposite to the film forming chamber 4 withrespect to the plasma forming region between the targets 5 a, 5 b. Theargon gas supplied from the gas supplier 31 flows into the plasmaforming region (target opposing region) from the side wall 34 side, thenflow into the film forming chamber 4 through the equipment coupling part43. The argon gas supplied into the film forming chamber 4 flows in thedirection designated by the arrow 21 f and joins the oxygen gas which issupplied from the gas supplier 32 and flows in the direction pointed bythe arrow 22 f. The both gases flow toward the exhaust control unit 42.In the manufacturing apparatus 1 according to the embodiment, the argongas which is the sputtering gas flows along the Za direction in thedrawing toward the film forming chamber 4, the argon gas then joins theoxygen gas that flows in −X direction in the film forming chamber 4, thejointed gas then flows in −X direction. The oxygen gas and the argon gaswhich are the sputtering gas joins each other at an acute angle therebythe sputtering gas smoothly circulates. In this way, it is possible toprevent a gas flow at the joint point of the oxygen gas and the argongas from being disturbed. As a result, it is possible to prevent thatincident angles of the sputtered particle 5 p with respect to thesubstrate W vary largely.

The magnetic field generator 16 a is disposed at the side opposite tothe target 5 a of the first electrode 33 a, and the magnetic fieldgenerator 16 b is disposed at the side opposite to the target 5 b of thesecond electrode 33 b. Referring to FIG. 8B, the magnetic fieldgenerator 16 b has a rectangular frame shape which is arranged along theouter edge of the rectangular target 5 b, and the magnetic fieldgenerator 16 a has the same shape. The magnetic field generator 16 a andthe magnetic field generator 16 b oppose each other in the outer edgepart of the targets 5 a, 5 b that also oppose each other. The magneticfield generators 16 a, 16 b generate a magnetic filed of the Xadirection that encompasses the targets 5 a, 5 b in the sputteringequipment 3. The magnetic field serves as the electron capture meansthat traps the electrons contained in the plasma Pz.

A substrate holder 6 that supports a treated face (film forming face) ofthe substrate W horizontally (in parallel to the XY plane) is providedbelow the sputtering equipment 3. A carrier 6 a that moves the substrateholder 6 horizontally from the side of the unshown load lock chamber tothe opposite side is coupled to the substrate holder 6. Referring toFIG. 1, the direction in which the substrate W is moved by the carrier 6a is parallel to the X axis direction and orthogonal to the longitudinaldirection (Y axis direction) of the targets 5 a, 5 b.

The substrate holder 6 has a heater 7 (heating means) for heating thesubstrate W held by the holder. The substrate holder 6 further has acooler 8 c for cooling the substrate W held by the holder. The heater 7is coupled to a controller 7 a that includes a power supply and thelike. The heater heats up the substrate holder 6 to a desiredtemperature through a heating operation that is controlled by thecontroller 7 a and the substrate W is heated to a desired temperature.The cooler 8 c is coupled to the substrate holder 6 through arefrigerant circulator 18 c, a pipe and the like. The substrate holder 6is cooled to a desired temperature by circulating the refrigerantsupplied from the refrigerant circulator 18 c and the substrate W iscooled to a desired temperature.

When the manufacturing apparatus 1 forms the inorganic alignment film onthe substrate W which is a component of the liquid crystal device, a DCpower (RF power) is supplied to the first electrode 33 a and the secondelectrode 33 b while the argon gas is introduced from the gas supplier31. The plasma Pz is generated in the space between the targets 5 a, 5b, argon ions and the like in the plasma atmosphere are then collided tothe targets 5 a, 5 b, and an alignment film material (silicon) issputtered out from the targets 5 a, 5 b as the sputtered particle 5 p.At the same time, among the sputtered particles 5 p contained in theplasma Pz, only the sputtered particles 5 p that fly from the plasma Pzto the side of the opening 3 a are selectively emitted toward the filmforming chamber 4 side. The sputtered particles 5 p that fly in anoblique direction onto the substrate W is reacted with the oxygen gasthat circulates in the film forming chamber 4 on the substrate W. Inthis way, the inorganic alignment layers 11 a, 22 a that are made ofsilicon oxide are formed on the substrate W.

Method for Manufacturing the Liquid Crystal Device

A method for manufacturing the liquid crystal device 100 according tothe embodiment will be now described. In the following description, amethod for forming the alignment films 11, 22 are mainly described. Thedescription starts from a step after the formation of wiring lines suchas the scan lines, the data lines and capacitor lines, drive circuitelements such as TFT, the pixel electrodes 9, the common electrode 21and the like have been completed in the circuit substrate 10 and thecounter substrate 20.

A step of forming the inorganic alignment layer 11 a and the organicalignment layer 11 b on the inner face side of the circuit substrate 10by using the above-described manufacturing apparatus 1 will be alsohereunder described. A process of forming the inorganic alignment layer22 a and the organic alignment layer 22 b on the inner face side of thecounter substrate 20 is same as a manufacturing process of forming theinorganic alignment layer 11 a and the organic alignment layer 11 btherefore its description is hereunder omitted.

Inorganic Alignment Layer Forming Step

Referring to FIGS. 7A and 7B, the circuit substrate 10 is fixed onto thesubstrate holder 6, then moved and disposed at a predetermined positionin the film forming chamber 4 by the carrier 6 a. Subsequently, thecounter target type sputtering equipment 3 that is disposed at thepredetermined angle θ1 from the circuit substrate 10 sputters out thesputtered particles 5 p which are emitted from the opening 3 a as thealignment film material. The sputtered particles enter obliquely ontothe film forming face of the circuit substrate 10 at the predeterminedangle θ1.

In the above-described manner, the sputtered particles 5 p which are thealignment film material fall obliquely onto the circuit substrate 10 andare deposited on the film forming face. In this way, referring to FIG.2B, the inorganic alignment layer 11 a having a plurality of thecolumnar structures in which crystals grow in an oblique direction withrespect to the normal line L1 of the circuit substrate 10 is obtained.

At this point, the angle θ1 of the sputtering equipment 3 is set tosmaller than 60° in the manufacturing apparatus 1, and the emissionangle of the sputtered particle 5 p with respect to the normal line L1(Z axis direction in FIGS. 7A and 7B) of the circuit substrate 10 ispreferably set to smaller than 60° in the sputtering equipment 3. Inthis embodiment, the manufacturing apparatus 1 is configured such thatthe angle θ1 is 45° and the emission angle of the sputtered particle 5 pwith respect to the normal line L1 of the circuit substrate 10 is set to45° or smaller.

Table 1 shows a relation between the emission angle (film forming angle)of the sputtered particle 5 p and properties of the formed inorganicalignment layer 11 a and a distance TS (see FIGS. 7A and 7B) between thesputtering apparatus 3 and the film forming face of the circuitsubstrate 10.

TABLE 1 Film forming angle (°) 45 60 80 Pretilt angle (°) 1.2 2.5 3.8Film thickness (nm) 97 85 62 Distance TS (mm) 150 250 1300

As shown in Table 1, when the film forming angle is 45°, the pretiltangle (pretilt capability) which the inorganic alignment layer 11 a canprovide to the liquid crystal molecule 52 was about 1.2°. In this case,the film thickness of the inorganic alignment layer 11 a after thesputtered particles 5 p were deposited for a predetermined time periodwas about 100 nm. The distance TS between the sputtering apparatus 3 andthe film forming face of the circuit substrate 10 was about 150 mm.

When the film forming angle is about 60°, the pretilt capability of theinorganic alignment layer 11 a can be increased to about 2.5°. Howeverthe distance TS between the sputtering apparatus 3 and the film formingface of the circuit substrate 10 is also increased (doubled) to about250 mm so that the film formation rate decreased and it will take abouttwice longer to fabricate the film compared to the case of the filmforming angle of about 45°.

When the film forming angle is about 80°, the pretilt capability of theinorganic alignment layer 11 a can be increased to about 3.8°. Howeverthe distance TS between the sputtering apparatus 3 and the film formingface of the circuit substrate 10 is significantly increased to about1300 mm so that the film formation rate drops dramatically and it willtake about seventy times longer to fabricate the film compared to thecase of the film forming angle of about 45°.

Considering the facts above, it is preferable that the film formingangle be as small as possible. More specifically, it is preferable thatthe angle is smaller than 60°. In this way, it is possible to preventthe film formation rate of the inorganic alignment layer 11 a from beinglowered and prevent the production rate of the liquid crystal device 100from being decreased. At the same time, the distance TS between thecircuit substrate 10 and the sputtering apparatus 3 can be made smallerthan 250 mm and it is possible to downsize the manufacturing apparatus1.

Moreover, according to the embodiment, the film formation rate of theinorganic alignment layer 11 a can be further improved by setting thefilm forming angle to 45°. In this way, it is possible to improve theproduction rate of the liquid crystal device 100. Furthermore, thedistance TS between the circuit substrate 10 and the sputteringapparatus 3 can be made as small as 150 mm and it is possible to furtherdownsize the manufacturing apparatus 1.

According to the embodiment, the sputtered particles that are notemitted from the opening 3 a in the counter target type sputteringequipment 3 are mostly entered onto the targets 5 a, 5 b and reused.Therefore it is possible to obtain a very high target use efficiency.The sputtering equipment 3 can enhance the directivity of the sputteredparticles 5 p emitted from the opening 3 a by narrowing the distancebetween the targets. Thereby an incident angle θ1 of the sputteredparticle 5 p arriving on the circuit substrate 10 can be highlycontrolled and it is possible to obtain finely aligned columnarstructures in the formed inorganic alignment layer 11a.

In the process of forming the inorganic alignment layer 11 a, a magneticfield that is generated by the rectangular-frame shaped magnetic fieldgenerators 16 a, 16 b surrounding the targets 5 a, 5 b of the sputteringequipment 3 can capture or reflect electrons 5 r contained in the plasmaPz. In this way, the plasma Pz can be securely trapped in the spacebetween the opposing targets 5 a, 5 b. As a result, it is possible toprevent wettability of the substrate W surface from being increased dueto the above mentioned electrons 5 r that enter onto the film formingface of the substrate W. Therefore the formation of the column structurewill not be disturbed since the sputtered particles 5 p once attached tothe circuit substrate 10 will not be relocated. Moreover, it is possibleto improve a coating property of a silane coupling agent which will behereunder described when the organic alignment layer 11 b is formed.

It is preferable that electric potentials of walls of the film formingchamber 4 and the equipment coupling part 43 which exist between theopening 3 a and the circuit substrate 10 be retained as a groundpotential. In this way, electrons that are leaked from the electroncapture means can be trapped and removed by the walls and it is possibleto effectively prevent the wettability of the surface of the circuitsubstrate 10 from being increased.

Energy of the sputtered particle 5 p (alignment film material) emittedfrom the target by sputtering is for example 10 eV which issignificantly high compared to energy of a cluster particle generatedfrom an evaporation source by a deposition method, which is for example0.1 eV. This means an adhesion property of the sputtered particle 5 p ishigher than that of the cluster particle generated by the depositionmethod. More specifically, in case of the cluster particle, the particleonce attached to the inner wall faces of, for example, the film formingchamber 4 and the equipment coupling part 43 can be detached and fallenby vibration or the like, and it becomes foreign particles and it may bestuck on the circuit substrate 10. On the other hand, in case of thesputtered particle 5 p, it will not be detached or fallen easily onceattached to the inner wall face because of its high adhesion, and atrouble such that the particle sticks onto the substrate W as foreignparticles will not occur.

Furthermore, since the cooler 8 c for cooling the circuit substrate 10is provided to the substrate holder 6, the circuit substrate 10 iscooled by the cooler 8 c at the time of the film formation and thetemperature of the circuit substrate 10 can be retained at apredetermined temperature such as a room temperature. In this way, it ispossible to reduce diffusion (migration) of the alignment film materialmolecules attached onto the circuit substrate 10 by sputtering.Consequently growth of the alignment film material is promoted locallyon the circuit substrate 10 and the inorganic alignment layer 11 a inwhich the column structure grew in an uniaxial direction can be easilyobtained.

Organic Alignment Layer Formation Step

The surface of the inorganic alignment layer 11 a formed through theabove-described process is treated with a silane coupling agent that hasan alkyl group as a functional group. As the silane coupling agent, forexample, one represented by the following formula (1) can be used.

C_(n)H_(2n+1)—Si—Y   (1)

where Y can be an alkoxy group (—OR), halogen (—Cl) or the like, “n” isa positive integer that lies within the range of 6 to 18 (bothinclusive).

A specific example of such silane coupling agent includesCH₃(CH₂)₅Si(OCH₃) wherein the number of carbon atoms in the alkyl groupis 6, (C₆H₅)₂SiCl₂ wherein the number of carbon atoms in the alkyl groupis 12, and CH₃(CH₂)₁₇Si(OH₃) wherein the number of carbon atoms in thealkyl group is 18.

Referring to FIG. 4, in the embodiment, the pretilt angle θ of theliquid crystal molecule 52 is set to a desired angle by selecting asilane coupling agent depending on the number of the carbon atoms.

There are two methods which can be applied to the surface treatment ofthe inorganic alignment layer 11 a by using a silane coupling agent, oneis a gas phase method and the other is a liquid phase method. Accordingto the gas phase method, for example, the circuit substrate 10 on whichthe inorganic alignment layer 11 a is formed is put into a chemicalvapor deposition (CVD) apparatus, a silane coupling agent is introducedin a form of vapor, and the surface of the inorganic alignment layer 11a is treated with the vapor of the silane coupling agent. According tothe liquid phase method, a silane coupling agent is dissolved in anadequate solvent and the surface of the inorganic alignment layer 11 ais treated with the solution.

A specific example of the surface treatment method encompasses a contactprocessing including an apply method such as spin-coating and a spraymethod, a dipping method and the like. For example, when a surface partof the inorganic alignment layer 11 a is treated by immersing thecircuit substrate 10 into a silane coupling solution, it is preferablethat ultrasonic sound be applied to the circuit substrate 10 and thesolution or a treatment chamber be depressurized. With the ultrasonicwave treatment or the depressurize treatment, the silane couplingsolution well gets through pores in the surface part of the inorganicalignment layer 11 a and the solution is well reacted with silanolgroups (Si—OH) in the pores.

On the inorganic alignment layer 11 a to which the surface treatment hasbeen performed as described above, the organic alignment layer 11 bwhich is the monomolecular film made of the organic material having anorganic functional group is provided.

Through the above described process, provided is the alignment film 11in which the organic alignment layer 11 b made of the organicmonomolecular film that is chemically bonded with the inorganicalignment layer 11 a is formed on the inorganic alignment layer 11 a.

According to the embodiment, the pretilt angle θ of the liquid crystalmolecule 52 is set to a desired angle by selecting the silane couplingagent which is used for the surface treatment of the inorganic alignmentlayer 11 a depending on the number of the carbon atoms. For example,referring to FIG. 4, the pretilt angle θ which can be provided to theliquid crystal molecule 52 with the alignment film 11 can be set in therange of about 3° to 8° (both inclusive) by using the silane couplingagent having the number of the carbon atoms of 6 to 18 (both inclusive).

Referring to FIG. 5, when a silane coupling agent with the number of thecarbon atoms of 8 to 10 (both inclusive) is, for example, used, it ispossible to manufacture the alignment film 11 that has both the moistureresistance and the light resistance.

Referring to FIG. 4, when a silane coupling agent with the number of thecarbon atoms of 10 or more but less than 18 is used, it is possible toset the pretilt capability of the alignment film 11 to an optimum rangeof about 4° to 6° (both inclusive). Consequently it is possible toimprove the display quality of the liquid crystal device 100.

Moreover, by setting the pretilt angle θ of the liquid crystal molecule52 to 3° or more, it is possible to prevent the display quality of theliquid crystal device 100 from being deteriorated.

Furthermore, the pretilt angle θ provided by the alignment film 11 canbe adjusted to a desired angle by selecting a silane coupling agentwhich is used at the time when the inorganic alignment layer 11 b isformed by conducting a surface treatment of the inorganic alignmentlayer 11 a. This means that it is not necessary to increase the emissionangle of the alignment film material in order to increase the pretiltangle θ. Therefore it is possible to prevent the film formation frombeing decreased and to avoid that the size of the manufacturingapparatus 1 gets large.

Moreover, even when the inorganic alignment layer 11 a is made ofsilicon oxide, the organic alignment layer 11 b can be formed on thesurface of the inorganic alignment layer 11 a and the organic alignmentlayer 11 b can be chemically bonded to the silanol group through aside-chain alkyl group. Thereby activity of a hydroxyl group in thesilanol group can be crippled. As a result, water adsorption and thelike of the hydroxyl group in the inorganic alignment layer 11 a can beeliminated.

As described above, according to the embodiment, it is possible toprovide a method for manufacturing the liquid crystal device 100 inwhich the pretilt angle θ of the liquid crystal molecules 52 can beadjusted to a desired value and the alignment films 11, 22 having a highmoisture resistance can be formed. Moreover, according to theembodiment, it is possible to provide a method for manufacturing theliquid crystal device 100 with which downsizing of the manufacturingapparatus 1 is possible and a fine film formation rate can be obtained.

Moreover the organic alignment layer 11 b can align the liquid crystalmolecules 52 finely with its organic functional groups. Furthermore, bycovering the surface of the inorganic alignment layer 11 a, awater-repellent property is provided to the surface and the moistureresistance and the light resistance can be enhanced. Micro sized poresin the surface of the inorganic alignment layer 11 a are filled with theorganic material so that the surface can be made dense. Thereby it ispossible to increase adhesion between the inorganic alignment layer 11 aand a sealant (not shown in the drawings) that adhesively bonds thecircuit substrate 10 and the counter substrate 20 of the liquid crystalpanel 50 and seals the liquid crystal layer 50. In this way, it ispossible to increase air-tightness in the sealing part interface betweenthe inorganic alignment layer 11 a and the sealant.

If a silane coupling agent having an alkyl chain with the number ofcarbon atoms of less than 6 is used, the alignment property which can begiven to the liquid crystal is decreased and there is a possibility thatthe alignment film cannot fulfill its function. Whereas if the number ofthe carbon atoms is more than 18, a steric hindrance at the adjacentalkyl chain 28 becomes too large and attachments of the alkyl chains 28onto the inorganic alignment layers 11 a, 22 a become uneven. For thesereasons, the embodiment sets the number of the carbon atoms of thesilane coupling agent to 6 to 18 (both inclusive), and theabove-mentioned troubles will not occur.

The invention is obviously not limited to the specific embodimentsdescribed herein, but also encompasses any variations that may beconsidered by any person skilled in the art, within the general scope ofthe invention. For example, various silane coupling agents can be usedprovided that they satisfies with the above mentioned condition.

What is claimed is:
 1. A liquid crystal device comprising: a substrate;an alignment film which is formed on one side of the substrate; aninorganic alignment layer having a plurality of columnar structures inwhich crystals grow in an oblique direction with respect to a normalline of the substrate, the inorganic alignment layer having an SiO or anSiO2 material; and an organic alignment layer on a surface of theinorganic alignment layer having an alkyl group and Si atom, the Si atombeing directly bonded to oxygen of the SiO or SiO2 material of theinorganic alignment layer, and the Si atom bonding the alkyl group tothe SiO or SiO2 material of the inorganic alignment layer, wherein thealkyl group is an alkyl chain consisting essentially of 6 to 18 carbonatoms.
 2. The liquid crystal device according to claim 1, wherein thealkyl group is an alkyl chain consisting essentially of 8 to 10 carbonatoms.
 3. The liquid crystal device according to claim 1, wherein thealkyl group is an alkyl chain consisting essentially of 10 or more butless than 18 carbon atoms.
 4. The liquid crystal device according toclaim 1, wherein a pretilt angle of the alignment film is set to 3° ormore from the normal line direction.